Two EVGA GTX 1080 FTW cards have now been run through a few dozen hours of testing, each passing through real-world, synthetic, and torture testing. We've been following this story since its onset, initially validating preliminary thermal results with thermal imaging, but later stating that we wanted to follow-up with direct thermocouple probes to the MOSFETs and PCB. The goal with which we set forth was to create the end-all, be-all set of test data for VRM thermals. We have tested every reasonable scenario for these cards, including SLI, and have even intentionally attempted to incinerate the cards by running ridiculous use scenarios. Thermocouples were attached directly to the back-side of the PCB (hotspot previously discovered), the opposing MOSFET (#2, from bottom-up), and MOSFET #7. The seventh and second MOSFETs are those which seem to be most commonly singed or scorched in user photos of allegedly failed EVGA 10-series ACX 3.0 cards, including the GTX 1060 and GTX 1070. Our direct probe contact to these MOSFETs will provide more finality to testing results, with significantly greater accuracy and understanding than can be achieved with a thermal imager pointed at the rear-side of the PCB. Even just testing with a backplate isn't really ideal with thermal cameras, as the emissivity of the metal begins to make for questionable results -- not to mention the fact that the plate visually obstructs the actual components. And, although we did mirror EVGA & Tom's DE's testing methodology when checking the impact of thermal pads…